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Reel/Frame:038815/0748   Pages: 8
Recorded: 06/06/2016
Attorney Dkt #:P20150862US00/1085.01506
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/23/2021
Application #:
15076976
Filing Dt:
03/22/2016
Publication #:
Pub Dt:
09/28/2017
Title:
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD FOR 3D INTEGRATED CIRCUITS
Assignors
1
Exec Dt:
03/29/2016
2
Exec Dt:
03/29/2016
3
Exec Dt:
03/28/2016
4
Exec Dt:
03/29/2016
5
Exec Dt:
03/29/2016
6
Exec Dt:
03/29/2016
Assignee
1
NO. 8, LI-HSIN ROAD 6
HSINCHU SCIENCE PARK
HSIN-CHU, TAIWAN 300-77
Correspondence name and address
DUANE MORRIS LLP (TSMC) IP DEPARTMENT
30 SOUTH 17TH STREET
PHILADELPHIA, PA 19103-4196

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