Patent Assignment Details
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| Reel/Frame: | 036023/0750 | |
| Pages: | 3 |
| | Recorded: | 07/08/2015 | | |
| Attorney Dkt #: | 0150193 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/29/2018
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Application #:
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14794032
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Filing Dt:
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07/08/2015
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Publication #:
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Pub Dt:
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02/18/2016
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Title:
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Method of Fabricating a Semiconductor Wafer Including a Through Substrate Via (TSV) and a Stepped Support Ring on a Back Side of the Wafen
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Assignee
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| 4321 JAMBOREE ROAD |
| NEWPORT BEACH, CALIFORNIA 92660 |
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Correspondence name and address
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MICHAEL FARJAMI
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26522 LA ALAMEDA AVE. SUITE 360
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MISSION VIEJO, CA 92691
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