Patent Assignment Details
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Reel/Frame: | 043040/0750 | |
| Pages: | 5 |
| | Recorded: | 07/19/2017 | | |
Attorney Dkt #: | 104000-200 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15399525
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Filing Dt:
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01/05/2017
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Publication #:
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Pub Dt:
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05/10/2018
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Title:
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Substrate Based Fan-Out Wafer Level Packaging
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Assignee
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9TH FLOOR, UBN TOWER, NO. 10 |
JALAN P. RAMLEE |
KUALA LUMPUR, MALAYSIA 50250 |
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Correspondence name and address
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ANDREW D. BOCHNER
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437 MADISON AVENUE
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WIGGIN AND DANA LLP, 35TH FLOOR
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NEW YORK, NY 10022
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06/19/2024 11:41 PM
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