Patent Assignment Details
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Reel/Frame: | 011248/0751 | |
| Pages: | 7 |
| | Recorded: | 10/10/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/23/2002
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Application #:
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09685941
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Filing Dt:
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10/10/2000
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Title:
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REDISTRIBUTED BOND PADS IN STACKED INTEGRATED CIRCUIT DIE PACKAGE
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Assignee
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2465 LATHAM STREET |
MOUNTAIN VIEW, CALIFORNIA 94040 |
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Correspondence name and address
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PENNIE & EDMONDS LLP
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WILLIAM S. GALLIANI
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3300 HILLVIEW AVENUE
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PALO ALTO, CA 94304
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