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Patent Assignment Details
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Reel/Frame:029300/0755   Pages: 10
Recorded: 11/15/2012
Attorney Dkt #:GTRC5192
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/01/2016
Application #:
13582453
Filing Dt:
11/13/2012
Publication #:
Pub Dt:
05/16/2013
Title:
THROUGH-PACKAGE-VIA (TPV) STRUCTURES ON INORGANIC INTERPOSER AND METHODS FOR FABRICATING SAME
Assignors
1
Exec Dt:
10/19/2012
2
Exec Dt:
09/12/2012
3
Exec Dt:
10/19/2012
4
Exec Dt:
10/19/2012
5
Exec Dt:
10/19/2012
6
Exec Dt:
10/19/2012
Assignee
1
505 TENTH STREET, NW
ATLANTA, GEORGIA 30332-0415
Correspondence name and address
RYAN A. SCHNEIDER
600 PEACHTREE STREET, NE, SUITE 5200
BANK OF AMERICA PLAZA
ATLANTA, GA 30308-2216

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