Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 057560/0755 | |
| Pages: | 5 |
| | Recorded: | 09/22/2021 | | |
Attorney Dkt #: | 2102882/1173-723 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17409481
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Filing Dt:
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08/23/2021
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Publication #:
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Pub Dt:
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02/23/2023
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Title:
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STACKED DIE INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING INTERPOSER FOR COUPLING AN UPPER STACKED DIE(S) TO A PACKAGE SUBSTRATE FOR PACKAGE HEIGHT REDUCTION, AND RELATED FABRICATION METHODS
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Assignee
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121-1714 |
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Correspondence name and address
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W&T/QUALCOMM
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106 PINEDALE SPRINGS WAY
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CARY, NC 27511
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09/23/2024 08:24 PM
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