Patent Assignment Details
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Reel/Frame: | 036138/0757 | |
| Pages: | 5 |
| | Recorded: | 07/20/2015 | | |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CORRESPONDENCE INFORMATION PREVIOUSLY RECORDED AT REEL: 036025 FRAME: 0829. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/11/2016
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Application #:
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14794185
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Filing Dt:
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07/08/2015
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Title:
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METHOD FOR MANUFACTURING WAFER-LEVEL FAN-OUT PACKAGE
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Assignee
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16, BAEKSEOKGONGDAN 7-RO, SEOBUK-GU |
CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 330-220 |
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Correspondence name and address
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NOVAK DRUCE CONNOLLY BOVE + QUIGG LLP
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1875 I STREET, N.W.
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ELEVENTH FLOOR
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WASHINGTON, DC 20006
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