Patent Assignment Details
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Reel/Frame: | 051233/0757 | |
| Pages: | 7 |
| | Recorded: | 12/10/2019 | | |
Attorney Dkt #: | 28373US04 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/08/2021
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Application #:
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16707411
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Filing Dt:
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12/09/2019
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Publication #:
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Pub Dt:
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06/11/2020
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUFACTURING METHOD THEREOF
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Assignee
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2045 E. INNOVATION CIRCLE |
TEMPE, ARIZONA 85284 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 WEST MADISON STREET
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34TH FLOOR
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CHICAGO, IL 60661
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09/25/2024 01:59 PM
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