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Patent Assignment Details
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Reel/Frame:012858/0759   Pages: 3
Recorded: 04/29/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/22/2004
Application #:
10135955
Filing Dt:
04/29/2002
Publication #:
Pub Dt:
09/11/2003
Title:
HIGHLY CONDUCTIVE MOLDING COMPOUNDS HAVING AN INCREASED DISTRIBUTION OF LARGE SIZE GRAPHITE PARTICLES
Assignor
1
Exec Dt:
04/25/2002
Assignee
1
1310 SOUTH VALLEY CENTER DRIVE
BAY CITY, MICHIGAN 48706
Correspondence name and address
HUDAK & SHUNK CO., LPA.
LAURA F. SHUNK
STE. 808
7 WEST BOWERY ST.
AKRON, OH 44308

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