Patent Assignment Details
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| Reel/Frame: | 020456/0759 | |
| Pages: | 4 |
| | Recorded: | 02/01/2008 | | |
| Attorney Dkt #: | YOR919930028US24 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11929911
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Filing Dt:
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10/30/2007
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Publication #:
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Pub Dt:
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05/15/2008
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Title:
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HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
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Assignee
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| 400 GARDEN CITY PLAZA, SUITE 300 |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION, T.J. WATSON RESEARCH CE
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P.O. BOX 218
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YORKTOWN HEIGHTS, NY 10598
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