Patent Assignment Details
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| Reel/Frame: | 024328/0759 | |
| Pages: | 2 |
| | Recorded: | 05/04/2010 | | |
| Attorney Dkt #: | P/4076-236 (V 15521) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12773099
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Filing Dt:
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05/04/2010
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Publication #:
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Pub Dt:
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11/10/2011
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Title:
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SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS USING MULTIPLE SOLDER WIRES
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Assignee
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| 20/F., WATSON CENTRE |
| 16-22 KUNG YIP ST. |
| KWAI CHUNG, HONG KONG |
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Correspondence name and address
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OSTROLENK FABER LLP
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1180 AVENUE OF THE AMERICAS
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NEW YORK, NY 100368403
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