Patent Assignment Details
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Reel/Frame: | 016966/0760 | |
| Pages: | 2 |
| | Recorded: | 09/07/2005 | | |
Attorney Dkt #: | 64084(71987) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11222386
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Filing Dt:
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09/07/2005
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Publication #:
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Pub Dt:
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03/23/2006
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Title:
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Semiconductor package, and fabrication method and carrier thereof
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Assignee
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NO. 123, SEC. 3, DA FONG ROAD |
TANTZU |
TAICHUNG, TAIWAN ROC |
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Correspondence name and address
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PETER F. CORLESS
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EDWARDS & ANGELL, LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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