Patent Assignment Details
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Reel/Frame: | 027574/0760 | |
| Pages: | 3 |
| | Recorded: | 01/23/2012 | | |
Attorney Dkt #: | 10086.2000 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/16/2013
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Application #:
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13313282
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Filing Dt:
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12/07/2011
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Publication #:
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Pub Dt:
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06/14/2012
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Title:
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METHOD FOR THINNING AND DICING ELECTRONIC CIRCUIT WAFERS
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Assignee
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16, RUE PIERRE ET MARIE CURIE |
TOURS, FRANCE 37100 |
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Correspondence name and address
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THE NOBLITT GROUP, PLLC
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8800 NORTH GAINEY CENTER DRIVE
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SUITE 279
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SCOTTSDALE, AZ 85258
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