Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058538/0763 | |
| Pages: | 5 |
| | Recorded: | 01/04/2022 | | |
| Attorney Dkt #: | 1012-3121 / 2021P04684 US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17556341
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Filing Dt:
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12/20/2021
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Publication #:
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Pub Dt:
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06/22/2023
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Title:
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SEMICONDUCTOR PACKAGE INTERCONNECT AND POWER CONNECTION BY METALLIZED STRUCTURES ON PACKAGE BODY
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Assignee
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MURPHY BILAK & HOMILLER/INFINEON TECHNO
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1255 CRESCENT GREEN
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CARY, NC 27518
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