Patent Assignment Details
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Reel/Frame: | 012228/0764 | |
| Pages: | 3 |
| | Recorded: | 09/27/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/27/2005
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Application #:
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09966914
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Filing Dt:
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09/27/2001
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Title:
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INTEGRATED CHIP PACKAGE HAVING INTERMEDIATE SUBSTRATE
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Assignee
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4TH FLOOR WINDSOR PLACE |
22 QUEEN STREET |
HAMILTON HM 11, BERMUDA |
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Correspondence name and address
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MARVEL SEMICONDUCTOR, INC.
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ERIC B. JANOFSY
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645 ALMANOR AVENUE
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SUNNYVALE, CO 94086
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