Patent Assignment Details
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| Reel/Frame: | 015481/0765 | |
| Pages: | 5 |
| | Recorded: | 06/21/2004 | | |
| Attorney Dkt #: | NSC1P295/P05886 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/05/2007
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Application #:
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10789258
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Filing Dt:
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02/26/2004
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Title:
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DIE ATTACH PAD FOR USE IN SEMICONDUCTOR MANUFACTURING AND METHOD OF MAKING SAME
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Assignee
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95051 |
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Correspondence name and address
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BEYER WEAVER & THOMAS LLP
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P.O. BOX 70250
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OAKLAND, CA 94612-0250
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