Patent Assignment Details
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| Reel/Frame: | 039571/0765 | |
| Pages: | 6 |
| | Recorded: | 08/04/2016 | | |
| Attorney Dkt #: | MEMSC-083XX |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE THE STATE OF INCORPORATION FROM MASSACHUSETTS TO DELAWARE PREVIOUSLY RECORDED ON REEL 035468 FRAME 0366. ASSIGNOR(S) HEREBY CONFIRMS THE THE STATE OF INCORPORATION SHOULD BE DELAWARE. |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/20/2017
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Application #:
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14683444
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Filing Dt:
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04/10/2015
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Publication #:
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Pub Dt:
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10/13/2016
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Title:
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WAFER LEVEL CHIP SCALE PACKAGED MICRO-ELECTRO-MECHANICAL-SYSTEM (MEMS) DEVICE AND METHODS OF PRODUCING THEREOF
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Assignee
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| ONE TECHNOLOGY DRIVE |
| SUITE 325 |
| ANDOVER, MASSACHUSETTS 02109 |
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Correspondence name and address
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PRETI FLAHERTY BELIVEAU & PACHIOS LLP
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60 STATE STREET
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BOSTON, MA 02109
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