Patent Assignment Details
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Reel/Frame: | 062901/0765 | |
| Pages: | 10 |
| | Recorded: | 03/07/2023 | | |
Attorney Dkt #: | 156954SDRC_16618697 |
Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16618697
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Filing Dt:
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12/02/2019
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Publication #:
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Pub Dt:
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06/18/2020
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Title:
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LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPARATUS
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Assignee
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13-9, SHIBA DAIMON 1-CHOME, MINATO-KU |
TOKYO, JAPAN 105-8518 |
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Correspondence name and address
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ALAN E. SCHIAVELLI
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700 12TH STREET NW, SUITE 700
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WASHINGTON, DC 20005
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09/23/2024 10:53 AM
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