Patent Assignment Details
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| Reel/Frame: | 064661/0765 | |
| Pages: | 3 |
| | Recorded: | 08/22/2023 | | |
| Attorney Dkt #: | 066160/597909 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18344218
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Filing Dt:
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06/29/2023
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Publication #:
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Pub Dt:
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02/15/2024
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Title:
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WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME
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Assignee
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| 9 DONGSHENG WEST ROAD |
| JIANGYIN CITY, JIANGSU PROVINCE, CHINA 214437 |
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Correspondence name and address
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ALSTON & BIRD
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1120 SOUTH TRYON STREET, SUITE 300
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CHARLOTTE, NC 28203-6818
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06/03/2024 05:10 AM
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