Patent Assignment Details
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| Reel/Frame: | 017581/0768 | |
| Pages: | 3 |
| | Recorded: | 02/17/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/13/2010
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Application #:
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11356129
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Filing Dt:
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02/17/2006
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Publication #:
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Pub Dt:
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08/24/2006
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Title:
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HEAT SINK, AN ELECTRONIC COMPONENT PACKAGE, AND A METHOD OF MANUFACTURING A HEAT SINK
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Assignee
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| 7-1, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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SEAN M. MCGINN, ESQ., REG. NO. 34,386
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MCGINN INTELLECTUAL PROPERTY
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LAW GROUP, PLLC
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8321 OLD COURTHOUSE RD., SUITE 200
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VIENNA, VA 22182
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