Patent Assignment Details
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| Reel/Frame: | 053129/0770 | |
| Pages: | 3 |
| | Recorded: | 07/06/2020 | | |
| Attorney Dkt #: | TWT07327/US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16920749
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Filing Dt:
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07/05/2020
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Publication #:
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Pub Dt:
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02/11/2021
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Title:
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THERMAL PRINT HEAD ELEMENT, THERMAL PRINT HEAD MODULE AND MANUFACTURING METHOD OF THE THERMAL PRINT HEAD MODULE
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Assignee
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| NO.10, INDUSTRY E.RD. 4 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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CKC & PARTNERS CO., LLC
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12345 LAKE CITY WAY NE, NO. 283
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SEATTLE, WA 98125
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06/21/2024 02:11 PM
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