Patent Assignment Details
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| Reel/Frame: | 054257/0771 | |
| Pages: | 6 |
| | Recorded: | 11/03/2020 | | |
| Attorney Dkt #: | TSMP20193052US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/15/2023
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Application #:
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16881211
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Filing Dt:
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05/22/2020
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Publication #:
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Pub Dt:
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11/25/2021
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Title:
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Giga Interposer Integration through Chip-On-Wafer-On-Substrate
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Assignee
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SLATER MATSIL, LLP
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17950 PRESTON RD., SUITE 1000
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DALLAS, TX 75252
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05/30/2024 07:20 AM
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