Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 055775/0771 | |
| Pages: | 6 |
| | Recorded: | 03/31/2021 | | |
| Attorney Dkt #: | 098322-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/21/2024
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Application #:
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17213241
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Filing Dt:
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03/26/2021
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Publication #:
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Pub Dt:
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09/29/2022
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignee
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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JCIPRNET
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8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
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TAIPEI, 100404 TAIWAN
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05/29/2024 11:27 PM
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