Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 028600/0772 | |
| Pages: | 3 |
| | Recorded: | 07/20/2012 | | |
Attorney Dkt #: | 1248/301 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
09/22/2015
|
Application #:
|
13554499
|
Filing Dt:
|
07/20/2012
|
Publication #:
|
|
Pub Dt:
|
01/24/2013
| | | | |
Title:
|
CHIP PACKAGE AND FABRICATION METHOD THEREOF
|
|
Assignee
|
|
|
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
JHONGLI CITY, TAOYUAN COUNTRY, TAIWAN 32062 |
|
Correspondence name and address
|
|
WEN LIU
|
|
444 S. FLOWER STREET, SUITE 1750
|
|
LOS ANGELES, CA 90071
|
Search Results as of:
09/23/2024 02:42 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|