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Reel/Frame:021057/0773   Pages: 3
Recorded: 05/28/2008
Attorney Dkt #:2557-000855/US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/31/2012
Application #:
12153952
Filing Dt:
05/28/2008
Publication #:
Pub Dt:
02/12/2009
Title:
METHOD OF FORMING DIELECTRIC INCLUDING DYSPROSIUM AND SCANDIUM BY ATOMIC LAYER DEPOSITION AND INTEGRATED CIRCUIT DEVICE INCLUDING THE DIELECTRIC LAYER
Assignors
1
Exec Dt:
04/02/2008
2
Exec Dt:
04/21/2008
3
Exec Dt:
04/02/2008
4
Exec Dt:
04/02/2008
5
Exec Dt:
04/23/2008
6
Exec Dt:
04/02/2008
7
Exec Dt:
04/02/2008
Assignee
1
416, MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondence name and address
HARNESS DICKEY & PIERCE, PLC
P.O. BOX 8910
RESTON, VA 20195

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