Patent Assignment Details
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| Reel/Frame: | 021057/0773 | |
| Pages: | 3 |
| | Recorded: | 05/28/2008 | | |
| Attorney Dkt #: | 2557-000855/US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/31/2012
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Application #:
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12153952
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Filing Dt:
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05/28/2008
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Publication #:
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Pub Dt:
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02/12/2009
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Title:
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METHOD OF FORMING DIELECTRIC INCLUDING DYSPROSIUM AND SCANDIUM BY ATOMIC LAYER DEPOSITION AND INTEGRATED CIRCUIT DEVICE INCLUDING THE DIELECTRIC LAYER
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Assignee
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| 416, MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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HARNESS DICKEY & PIERCE, PLC
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P.O. BOX 8910
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RESTON, VA 20195
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