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Patent Assignment Details
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Reel/Frame:061354/0774   Pages: 14
Recorded: 08/29/2022
Attorney Dkt #:28392US04; 28392US03
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
08/30/2022
Application #:
16148178
Filing Dt:
10/01/2018
Publication #:
Pub Dt:
02/07/2019
Title:
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN EXTENDED SUBSTRATE AND A BOTTOM SUBSTRATE
2
Patent #:
NONE
Issue Dt:
Application #:
17897556
Filing Dt:
08/29/2022
Publication #:
Pub Dt:
12/29/2022
Title:
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN EXTENDED SUBSTRATE AND A BOTTOM SUBSTRATE
Assignors
1
Exec Dt:
10/09/2014
2
Exec Dt:
10/09/2014
3
Exec Dt:
11/04/2014
4
Exec Dt:
11/04/2014
5
Exec Dt:
10/09/2014
6
Exec Dt:
10/20/2014
7
Exec Dt:
10/13/2014
8
Exec Dt:
10/22/2014
9
Exec Dt:
10/13/2014
10
Exec Dt:
11/04/2014
Assignee
1
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondence name and address
MCANDREWS, HELD & MALLOY, LTD.
500 W. MADISON STREET
3400
CHICAGO, IL 60661

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