Patent Assignment Details
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Reel/Frame: | 004363/0775 | |
| Pages: | 2 |
| | Recorded: | 01/28/1985 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/05/1986
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Application #:
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06695597
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Filing Dt:
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01/28/1985
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Title:
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SOLDER INTERCONNECTION STRUCTURE FOR JOINING SEMICONDUCTOR DEVICES TO SUBSTRATES THAT HAVE IMPROVED FATIGUE LIFE, AND PROCESS FOR MAKING
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Assignee
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A CORP. OF NY |
ARMONK, NEW YORK 10504 |
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Correspondence name and address
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WOLMAR J. STOFFEL
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IBM CORP., DEPT. 901, BLDG. 300/482
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HOPEWELL JUNCTION, NY 12533-9988
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