Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 017136/0775 | |
| Pages: | 10 |
| | Recorded: | 12/22/2005 | | |
| Conveyance: | TRANSLATION: TRANSLATION CERTIFICATE |
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Total properties:
10
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Patent #:
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Issue Dt:
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03/07/2006
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Application #:
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10751175
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER
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Patent #:
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Issue Dt:
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09/27/2005
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Application #:
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10751183
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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11/18/2004
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Title:
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SEMICONDUCTOR PACKAGE AND STRUCTURE THEREOF
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Patent #:
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Issue Dt:
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09/27/2005
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Application #:
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10751183
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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11/18/2004
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Title:
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SEMICONDUCTOR PACKAGE AND STRUCTURE THEREOF
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Patent #:
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Issue Dt:
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08/08/2006
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Application #:
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10751198
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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METHOD FOR PACKAGING A MULTI-CHIP MODULE OF A SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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10/11/2005
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Application #:
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10751199
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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METHOD FOR PACKAGING A SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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10/11/2005
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Application #:
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10751199
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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METHOD FOR PACKAGING A SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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10/10/2006
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Application #:
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10751200
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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METHOD FOR PACKAGING A MULTI-CHIP MODULE OF A SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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01/04/2005
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Application #:
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10751209
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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CERAMIC PACKAGING METHOD EMPLOYING FLIP-CHIP BONDING
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Patent #:
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Issue Dt:
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01/04/2005
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Application #:
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10751209
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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CERAMIC PACKAGING METHOD EMPLOYING FLIP-CHIP BONDING
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Patent #:
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Issue Dt:
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06/12/2007
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Application #:
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10751212
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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METHOD FOR PACKAGING A SEMICONDUCTOR DEVICE
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Assignee
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| 891-10 DAECHI-DONG |
| KANGNAM-KU |
| SEOUL, KOREA, REPUBLIC OF |
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Correspondence name and address
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ANDREW D. FORTNEY, PH.D.
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THE LAW OFFICES OF ANDREW D. ET AL
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7257 N. MAPLE AVE., SUITE 107
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FRESNO, CA 93720
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