Patent Assignment Details
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| Reel/Frame: | 034829/0775 | |
| Pages: | 2 |
| | Recorded: | 01/28/2015 | | |
| Attorney Dkt #: | 15701URS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14607352
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Filing Dt:
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01/28/2015
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Publication #:
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Pub Dt:
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07/28/2016
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Title:
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Methodology Of Incorporating Wafer Physical Measurement With Digital Simulation For Improving Semiconductor Device Fabrication
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Assignee
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| 5F-1, NO. 100, SEC. 1, JIAFENG 11TH RD. |
| ZHUBEI CITY |
| HSINCHU COUNTY, TAIWAN |
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Correspondence name and address
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JASON Z. LIN
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PO BOX 2339
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SARATOGA, CA 95070-0339
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06/23/2024 10:46 PM
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