Patent Assignment Details
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Reel/Frame: | 024061/0776 | |
| Pages: | 2 |
| | Recorded: | 03/10/2010 | | |
Attorney Dkt #: | BDG065 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/31/2012
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Application #:
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12721551
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Filing Dt:
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03/10/2010
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Publication #:
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Pub Dt:
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07/01/2010
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY WITH ALUMINUM POST/BASE HEAT SPREADER AND SILVER/COPPER CONDUCTIVE TRACE
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Assignee
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3RD FLOOR, 157 LI-TE ROAD, PEITOU DISTRICT |
TAIPEI, TAIWAN 112 |
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Correspondence name and address
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DAVID M. SIGMOND
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10 ANSON ROAD #47-14
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SINGAPORE, 079903 SINGAPORE
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