Patent Assignment Details
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Reel/Frame: | 040435/0776 | |
| Pages: | 32 |
| | Recorded: | 10/20/2016 | | |
Conveyance: | CHANGE OF ADDRESS |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/12/2002
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Application #:
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09214431
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Filing Dt:
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01/06/1999
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Title:
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ABRASIVE AND METHOD FOR POLISHING SEMICONDUCTOR SUBSTRATE
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Assignee
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1-1, MIKAGE-CHO, SHUNAN-SHI |
YAMAGUCHI, JAPAN |
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Correspondence name and address
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CPA GLOBAL LIMITED
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LIBERATION HOUSE
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CASTLE STREET
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ST HELIER, JE1 1BL JERSEY
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