Patent Assignment Details
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| Reel/Frame: | 011364/0778 | |
| Pages: | 3 |
| | Recorded: | 11/30/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/19/2002
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Application #:
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09728685
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Filing Dt:
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11/30/2000
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Title:
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Method of reducing electromigration in copper lines by forming an interim layer of calcium-doped copper seed layer in a chemical solution and semiconductor device thereby formed
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Assignee
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| F0908 |
| ONE AMD PLACE, M/S 68 |
| SUNNYVALE, CALIFORNIA 94088 |
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Correspondence name and address
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LARIVIERE, GRUBMAN & PAYNE, LLP
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MAY LIN DEHAAN
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P.O. BOX 3140
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P1238
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MONTEREY, CA 93940
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