Patent Assignment Details
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Reel/Frame: | 059526/0778 | |
| Pages: | 3 |
| | Recorded: | 04/07/2022 | | |
Attorney Dkt #: | MR3315-1216 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17714445
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Filing Dt:
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04/06/2022
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Publication #:
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Pub Dt:
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10/20/2022
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Title:
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BUMP STRUCTURE OF CHIP
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Assignee
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11F-1, NO. 5, TAIYUAN 1ST ST. |
JHUBEI CITY, HSINCHU COUNTY 302, TAIWAN |
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Correspondence name and address
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ROSENBERG, KLEIN & LEE
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3458 ELLICOTT CENTER DRIVE, SUITE 101
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ELLICOTT CITY, MD 21043
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09/25/2024 12:58 PM
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