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Reel/Frame:067569/0778   Pages: 11
Recorded: 05/30/2024
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC LTD. AND CORRECT THE NAME OF RECEIVING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC PTE. LTD. PREVIOUSLY RECORDED AT REEL: 64838 FRAME: 948. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME.
Total properties: 1
1
Patent #:
Issue Dt:
01/12/2010
Application #:
11462568
Filing Dt:
08/04/2006
Publication #:
Pub Dt:
02/07/2008
Title:
STACKABLE MULTI-CHIP PACKAGE SYSTEM WITH SUPPORT STRUCTURE
Assignor
1
Exec Dt:
03/29/2016
Assignee
1
5 YISHUN STREET 23
SINGAPORE, SINGAPORE
Correspondence name and address
YANGZHOU DU
8407 CENTRAL AVE, SUITE 2077
NEWARK, CA 94560-3431

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