Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 066408/0781 | |
| Pages: | 8 |
| | Recorded: | 02/07/2024 | | |
| Attorney Dkt #: | 34300.1549 (L0366C) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/12/2024
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Application #:
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17682948
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Filing Dt:
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02/28/2022
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Publication #:
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Pub Dt:
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06/09/2022
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Title:
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INTEGRATED CIRCUIT WIRE BONDED TO A MULTI-LAYER SUBSTRATE HAVING AN OPEN AREA THAT EXPOSES WIRE BOND PADS AT A SURFACE OF THE INNER LAYER
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Assignee
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| 800 SOUTH FEDERAL WAY |
| BOIE, IDAHO 83716-9632 |
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Correspondence name and address
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PATENT DOCKET ADMINISTRATOR
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LOWENSTEIN SANDLER LLP
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ONE LOWENSTEIN DRIVE
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ROSELAND, NJ 07068
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05/26/2024 12:12 AM
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