Patent Assignment Details
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Reel/Frame: | 021779/0782 | |
| Pages: | 3 |
| | Recorded: | 11/04/2008 | | |
Attorney Dkt #: | MTKP0472USA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12264272
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Filing Dt:
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11/04/2008
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Publication #:
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Pub Dt:
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05/06/2010
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Title:
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SEMICONDUCTOR DEVICE HAVING INTEGRATED CIRCUIT WITH PADS COUPLED BY EXTERNAL CONNECTING COMPONENT AND METHOD FOR MODIFYING INTEGRATED CIRCUIT
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Assignee
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NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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P.O.BOX 506
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MERRIFIELD, VA 22116
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