Patent Assignment Details
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| Reel/Frame: | 013592/0783 | |
| Pages: | 3 |
| | Recorded: | 12/18/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/25/2003
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Application #:
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10321427
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Filing Dt:
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12/18/2002
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Publication #:
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Pub Dt:
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07/03/2003
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Title:
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CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignee
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| 314 MAETAN-3-DONG, PALDAL-KU |
| SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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LOWE HAUPTMAN GILMAN & BERNER
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BENJAMIN J. HAUPTMAN
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STE. 300, 1700 DIAGONAL RD.
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ALEXANDRIA, VA 22314
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