Patent Assignment Details
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Reel/Frame: | 018057/0783 | |
| Pages: | 3 |
| | Recorded: | 07/12/2006 | | |
Attorney Dkt #: | CU-4857 WWP |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/08/2008
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Application #:
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11485226
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Filing Dt:
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07/12/2006
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Publication #:
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Pub Dt:
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10/04/2007
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Title:
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FLIP CHIP BONDED PACKAGE APPLICABLE TO FINE PITCH TECHNOLOGY
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Assignee
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SAN 136-1, AMI-RI |
BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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RICHARD J. STREIT
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C/O LADAS & PARRY
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224 SOUTH MICHIGAN AVENUE
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CHICAGO, IL 60604
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