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Reel/Frame:068814/0783   Pages: 6
Recorded: 10/07/2024
Attorney Dkt #:ST INC US/STI (3RD BULK)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 7
1
Patent #:
Issue Dt:
03/28/2017
Application #:
14705291
Filing Dt:
05/06/2015
Publication #:
Pub Dt:
11/10/2016
Title:
INTEGRATED TENSILE STRAINED SILICON NFET AND COMPRESSIVE STRAINED SILICON-GERMANIUM PFET IMPLEMENTED IN FINFET TECHNOLOGY
2
Patent #:
Issue Dt:
05/02/2017
Application #:
14724975
Filing Dt:
05/29/2015
Publication #:
Pub Dt:
12/01/2016
Title:
VIA, TRENCH OR CONTACT STRUCTURE IN THE METALLIZATION, PREMETALLIZATION DIELECTRIC OR INTERLEVEL DIELECTRIC LAYERS OF AN INTEGRATED CIRCUIT
3
Patent #:
Issue Dt:
09/11/2018
Application #:
15464487
Filing Dt:
03/21/2017
Publication #:
Pub Dt:
07/06/2017
Title:
VIA, TRENCH OR CONTACT STRUCTURE IN THE METALLIZATION, PREMATALLIZATION DIELECTRIC OR INTERLEVEL DIELECTRIC LAYERS OF AN INTEGRATED CIRCUIT
4
Patent #:
Issue Dt:
10/12/2021
Application #:
15599234
Filing Dt:
05/18/2017
Publication #:
Pub Dt:
11/22/2018
Title:
SENSING AN ICMFB OUTPUT TO DETECT FUNCTIONAL STATE OF A MEMS SENSOR
5
Patent #:
Issue Dt:
09/28/2021
Application #:
16180223
Filing Dt:
11/05/2018
Publication #:
Pub Dt:
03/14/2019
Title:
INTEGRATED TENSILE STRAINED SILICON NFET AND COMPRESSIVE STRAINED SILICON-GERMANIUM PFET IMPLEMENTED IN FINFET TECHNOLOGY
6
Patent #:
Issue Dt:
09/17/2024
Application #:
17472126
Filing Dt:
09/10/2021
Publication #:
Pub Dt:
12/30/2021
Title:
SENSING AN ICMFB OUTPUT TO DETECT FUNCTIONAL STATE OF A MEMS SENSOR
7
Patent #:
Issue Dt:
06/25/2024
Application #:
17542274
Filing Dt:
12/03/2021
Publication #:
Pub Dt:
06/08/2023
Title:
METHOD, SYSTEM, AND CIRCUITS FOR RF LOW-LATENCY, MULTIPLE PRIORITY COMMUNICATION USING DEFINED TRANSMISSION WINDOWS
Assignor
1
Exec Dt:
10/03/2024
Assignee
1
CHEMIN DU CHAMP-DES-FILLES 39
PLAN-LES-OUATES
GENEVA, SWITZERLAND 1228
Correspondence name and address
RAJ K. KRISHNAN
STMICROELECTRONICS, INC.
750 CANYON DRIVE, SUITE 300
COPPELL, TX 75019

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