Patent Assignment Details
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Reel/Frame: | 044292/0784 | |
| Pages: | 3 |
| | Recorded: | 12/05/2017 | | |
Attorney Dkt #: | MTKP3107USA4 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/19/2019
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Application #:
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15831408
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Filing Dt:
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12/05/2017
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Publication #:
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Pub Dt:
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04/05/2018
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Title:
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SEMICONDUCTOR PACKAGE
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Assignee
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NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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