Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 042987/0786 | |
| Pages: | 2 |
| | Recorded: | 07/12/2017 | | |
Attorney Dkt #: | TSMP20170842US00 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2020
|
Application #:
|
15647704
|
Filing Dt:
|
07/12/2017
|
Publication #:
|
|
Pub Dt:
|
10/11/2018
| | | | |
Title:
|
Packages with Si-substrate-free Interposer and Method Forming Same
|
|
Assignee
|
|
|
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
|
Correspondence name and address
|
|
SLATER MATSIL, LLP
|
|
17950 PRESTON RD., SUITE 1000
|
|
DALLAS, TX 75252
|
Search Results as of:
09/23/2024 08:15 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|