Patent Assignment Details
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Reel/Frame: | 008932/0789 | |
| Pages: | 4 |
| | Recorded: | 12/15/1997 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/27/1998
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Application #:
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08990986
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Filing Dt:
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12/15/1997
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Title:
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METHOD AND APPARATUS FOR GRINDING WAFERS
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Assignee
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8000 S. FEDERAL WAY |
BOISE, IDAHO 83706 |
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Correspondence name and address
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DICKSTEIN, SHAPIRO, MORIN AND OSHINSKY
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THOMAS D'AMICO, ESQ.
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2101 L STREET, N.W.
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4TH FLOOR
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WASHINGTON, D.C. 20037
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