Patent Assignment Details
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| Reel/Frame: | 011549/0791 | |
| Pages: | 3 |
| | Recorded: | 02/21/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/06/2002
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Application #:
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09720111
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Filing Dt:
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02/21/2000
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PCT #:
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GB9901928
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Title:
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WAFER EDGE POLISHING METHOD AND APPARATUS
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Assignee
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| 26 TEMPLE STREET |
| BUCKINGHAMSHIRE HP20 2RQ, UNITED KINGDOM |
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Correspondence name and address
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LEE, MANN, SMITH, MCWILLIAMS, ET AL
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WILLIAM M. LEE, JR.
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P.O. BOX 2786
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CHICAGO, ILLINOIS 60690-2786
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