Patent Assignment Details
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Reel/Frame: | 040081/0791 | |
| Pages: | 4 |
| | Recorded: | 10/21/2016 | | |
Attorney Dkt #: | 60968-US-PA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/03/2017
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Application #:
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15297158
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Filing Dt:
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10/19/2016
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Title:
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SOLDER BALL, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE
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Assignee
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NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK , |
HSINCHU, TAIWAN |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7F.-1, NO. 100, ROOSEVELT RD., SEC. 2,
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TAIPEI, 100 TAIWAN
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