Patent Assignment Details
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| Reel/Frame: | 062276/0791 | |
| Pages: | 4 |
| | Recorded: | 01/04/2023 | | |
| Attorney Dkt #: | 100IM1167US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18148815
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Filing Dt:
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12/30/2022
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Publication #:
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Pub Dt:
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07/20/2023
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Title:
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METHOD OF FORMING CONTACT STRUCTURE, METHOD OF FABRICATING SEMICONDUCTOR DEVICE, CONTACT STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
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Assignees
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUP |
| GYEONGGI-DO |
| ICHEON-SI, KOREA, REPUBLIC OF 17336 |
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| 1 CHUNGDAE-RO, SEOWON-GU, CHUNGCHEONGBUK-DO |
| CHEONGJU-SI, KOREA, REPUBLIC OF 28644 |
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| 2511 SEJONG-RO, JOCHIWON-EUP |
| SEJONG-SI, KOREA, REPUBLIC OF 30019 |
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| 152 GAJEONG-RO, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 34129 |
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Correspondence name and address
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AMPACC LAW GROUP, PLLC
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6100 219TH ST SW #580
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MOUNTLAKE TERRACE, WA 98043
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