Patent Assignment Details
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Reel/Frame: | 056169/0792 | |
| Pages: | 3 |
| | Recorded: | 05/07/2021 | | |
Attorney Dkt #: | JBL0368-US (246328) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17314356
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Filing Dt:
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05/07/2021
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Publication #:
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Pub Dt:
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04/07/2022
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Title:
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LOW TEMPERATURE, REWORKABLE, AND NO-UNDERFILL ATTACH PROCESS FOR FINE PITCH BALL GRID ARRAYS HAVING SOLDER BALLS WITH EPOXY AND SOLDER MATERIAL
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Assignee
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10560 DR. MARTIN LUTHER KING JR. STREET, NORTH |
ST. PETERSBURG, FLORIDA 33716 |
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Correspondence name and address
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SHUMAKER, LOOP & KENDRICK LLP
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1000 JACKSON STREET
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TOLEDO, OH 43604-5573
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09/25/2024 09:50 AM
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