Patent Assignment Details
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Reel/Frame: | 062196/0793 | |
| Pages: | 5 |
| | Recorded: | 12/23/2022 | | |
Attorney Dkt #: | 1012-3436/2019P55662 US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/02/2024
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Application #:
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18088238
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Filing Dt:
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12/23/2022
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Publication #:
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Pub Dt:
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04/27/2023
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Title:
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LAYER STRUCTURE WITH AN INTERMETALLIC PHASE LAYER AND A CHIP PACKAGE THAT INCLUDES THE LAYER STRUCTURE
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Assignee
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AM CAMPEON 1-15 |
NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER, PLLC/INFINEON
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P.O. BOX 1959
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CARY, NC 27512-1959
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09/23/2024 01:12 AM
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