Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 067248/0793 | |
| Pages: | 5 |
| | Recorded: | 04/29/2024 | | |
| Attorney Dkt #: | 3320-013 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18648581
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Filing Dt:
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04/29/2024
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Publication #:
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Pub Dt:
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01/02/2025
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Title:
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SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOLDER JOINT
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Assignee
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| 66, MURYONG 1-RO, BUK-GU |
| ULSAN, KOREA, REPUBLIC OF 44252 |
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Correspondence name and address
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SANGWON KIM
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2000 DUKE STREET, SUITE 300
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ALEXANDRIA, VA 22314
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08/25/2025 11:11 AM
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