Patent Assignment Details
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Reel/Frame: | 051125/0794 | |
| Pages: | 4 |
| | Recorded: | 11/27/2019 | | |
Attorney Dkt #: | KINN-001 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/23/2022
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Application #:
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16696850
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Filing Dt:
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11/26/2019
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Publication #:
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Pub Dt:
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06/25/2020
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Title:
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MODULAR PHYSICAL LAYER AND INTEGRATED CONNECTOR MODULE FOR LOCAL AREA NETWORKS
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Assignee
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8F, NO. 172, CHENG TEH ROAD |
TAIPEI, TAIWAN 11167 |
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Correspondence name and address
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RADLO & SU - PETER SU
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3000 ENFIELD STREET
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SAN RAMON, CA 94582
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06/19/2024 02:03 PM
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