Patent Assignment Details
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Reel/Frame: | 057301/0794 | |
| Pages: | 3 |
| | Recorded: | 08/26/2021 | | |
Attorney Dkt #: | 1012-3008 / 2021P00927 US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/30/2024
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Application #:
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17385596
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Filing Dt:
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07/26/2021
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Publication #:
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Pub Dt:
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01/26/2023
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Title:
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Power Module with Semiconductor Packages Mounted on Metal Frame
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Assignee
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SIEMENSSTRASSE 2 |
VILLACH, AUSTRIA 9500 |
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Correspondence name and address
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MURPHY BILAK & HOMILLER/INFINEON TECHNO
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1255 CRESCENT GREEN
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CARY, NC 27518
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05/28/2024 11:26 AM
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